Analyses of strips metallization effect on the delay time of integrated circuit elements

Author

Bourdoucen, H ; Issaoun, A. ; Djeddi, M.

Author_Institution

Nat. Inst. of Electr. & Electron., Boumerdes, Algeria

fYear

1993

fDate

1-4 Jun 1993

Firstpage

1051

Lastpage

1054

Abstract

The quasi-static parameters of planar lossless multiconductor transmission line systems are computed using the semianalytical method of lines with nonequidistant discretization. The effect of metallization thickness on the capacitance and inductance matrices of one, two, and five strips in a two-layer dielectric medium is taken into account. The propagation delay which is related to the inductance and capacitance matrices of these structures is considerably affected by the metallization thickness of the conductor strips. The relative variations of this time delay with respect to zero thickness approximation time delay for the structures studied reach about 20% for t/w of 30%

Keywords

capacitance; delays; inductance; integrated circuit interconnections; integrated circuit metallisation; microstrip lines; microwave integrated circuits; transmission line matrix methods; T-network interconnection equivalent circuit; capacitance matrix; delay time; inductance matrix; integrated circuit elements; metallization thickness; microstrip structure; microwave integrated circuit; nonequidistant discretization; planar lossless multiconductor transmission line systems; propagation delay; quasi-static parameters; semianalytical method of lines; strips metallization effect; time delay; two-layer dielectric medium; Capacitance; Delay effects; Dielectrics; Inductance; Metallization; Multiconductor transmission lines; Propagation delay; Propagation losses; Strips; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346706

Filename

346706