Transmission line analysis of MCM interconnects

Author

Beyne, Eric ; Peeters, Joris

Author_Institution

Interuniversitair Microelectron. Center, Leuven, Belgium

fYear

1993

fDate

1-4 Jun 1993

Firstpage

1022

Lastpage

1029

Abstract

The transmission line behavior of MCM-D interconnection lines is discussed with particular emphasis on the frequency dependent loss and delay characteristics. A broadband model covering the frequency spectrum from DC to RF is proposed. The applicability of this model is experimentally verified by comparison with measured S-parameters from 45 MHz to 18 GHz on test structures realized with two different MCM-D technologies. The broadband model is integrated in the time-domain network simulator TRANSPLUS. This program was developed for the simulation of the interconnection circuitry between chips, it thus includes models for the output circuits of the chips, the packaging, and the (coupled) interconnection lines. Simulations of different MCM-D interconnections between CMOS and bipolar chips are discussed

Keywords

S-parameters; circuit analysis computing; delays; losses; multichip modules; time-domain analysis; transmission line theory; 45 MHz to 18 GHz; MCM interconnects; MCM-D; S-parameters; TRANSPLUS; broadband model; delay characteristics; frequency dependent loss; time-domain network simulator; transmission line analysis; Circuit simulation; Delay; Frequency dependence; Integrated circuit interconnections; Propagation losses; Radio frequency; Semiconductor device measurement; Semiconductor device modeling; Transmission line measurements; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346726

Filename

346726