• DocumentCode
    2305710
  • Title

    Integrated cavity-backed ka-band phased array antenna

  • Author

    Lukic, Milan V. ; Filipovic, Dejan S.

  • Author_Institution
    Colorado Univ., Boulder
  • fYear
    2007
  • fDate
    9-15 June 2007
  • Firstpage
    133
  • Lastpage
    136
  • Abstract
    A planar 4x4 phased array antenna with 0.5 wavelength element spacing at 36 GHz is presented in this paper. The antenna is fabricated by a sequential surface micromachining process with ten structural layers. The radiators are rectangular coaxial line fed cavity backed patches. They are 2.8 mm long and 3.2 mm wide and have two slits for impedance matching and six holes for releasing sacrificial photoresist. The patches are supported with feeding probe and two metallic posts located in a plane of zero electric field. Analysis and design are conducted with finite element and finite integration based codes. The individual antenna elements have impedance bandwidth of about 5.1% around 36 GHz, with simulated gain and radiation efficiency of about 6.8 dBi and 95%, respectively. Computed characteristics of 16 independent, simultaneously available beams are also presented.
  • Keywords
    antenna feeds; antenna phased arrays; antenna radiation patterns; cavity resonators; finite element analysis; impedance matching; micromachining; microstrip antenna arrays; millimetre wave antenna arrays; planar antenna arrays; antenna elements; efficiency 95 percent; feeding probe; finite element based codes; finite integration based codes; frequency 36 GHz; impedance matching; integrated cavity-backed Ka-band phased array antenna; metallic posts; rectangular coaxial line fed cavity backed patches; sacrificial photoresist; sequential surface micromachining process; Antenna arrays; Bandwidth; Coaxial components; Computational modeling; Finite element methods; Impedance matching; Micromachining; Phased arrays; Probes; Resists;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2007 IEEE
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    978-1-4244-0877-1
  • Electronic_ISBN
    978-1-4244-0878-8
  • Type

    conf

  • DOI
    10.1109/APS.2007.4395448
  • Filename
    4395448