Multilayer glass ceramic substrate design for SS-1 supercomputer

The SS-1 supercomputer system requires a packaging technology which supports high signal propagation speed and dense wiring for a faster clock cycle time. This has been achieved by a packaging technology and a design which provides the right TOF, matching impedance and conductors with lower resistance. A number of technological advancements have been made from ES/9000 TCM to meet the supercomputer system requirements. These changes are discussed in detail and compared to the state-of-the-art technology of ES/9000. The substrate design, the thin film, and the interposer are described