Green Tape via design-FEM and proposed design philosophy

Author

Poulin, T.R. ; Nguyen, L.T.

Author_Institution

DuPont Med. Products, Newton, CT, USA

fYear

1993

fDate

1-4 Jun 1993

Firstpage

904

Lastpage

909

Abstract

A design method of thermal paths in Green Tape ceramics for chip cooling is described. Data from experimental substrates are examined both by thermal resistance measurements and finite element modeling to extract the major thermal characteristics of the Green Tape and the via materials. Curves are generated showing variation of the thermal impedance of the composite material as a function of via density and via fill material. A design example is given which shows how this method can be used to equalize junction temperatures in chips with different power densities. This design would be useful in bipolar circuits due to the clock skew induced by different V_be and switching thresholds when junction temperatures differ from one chip to the next

Keywords

ceramics; cooling; finite element analysis; heat sinks; integrated circuit technology; multichip modules; substrates; thermal analysis; thermal resistance; FEM; Green Tape via design; MCM; ceramics; chip cooling; chip junction temperatures equalisation; composite material; experimental substrates; finite element modeling; thermal characteristics; thermal impedance; thermal paths; thermal resistance measurements; via density; via fill material; via materials; Ceramics; Composite materials; Cooling; Data mining; Design methodology; Electrical resistance measurement; Finite element methods; Impedance; Temperature; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346744

Filename

346744