A comparison of modelling methods for electronic interconnect structures

Author

Ogunjimi, A.O. ; Whalley, David C. ; Williams, D.J.

Author_Institution

Dept. of Manuf. Eng., Loughborough Univ. of Technol., UK

fYear

1993

fDate

1-4 Jun 1993

Firstpage

871

Lastpage

876

Abstract

A comparison has been made between the use of 2-dimensional, axisymmetric and 3-dimensional geometry in the finite element analysis of a die attach assembly using conductive adhesives. The axisymmetric geometry was found to be a good approximation to the 3-dimensional geometry and gave considerable savings in computer resources and human effort. The true effect of the corners of the square die modelled was, however, not reflected in the stress level predicted by both of the more computationally efficient but simplified 2-dimensional and axisymmetric models

Keywords

adhesion; finite element analysis; integrated circuit technology; microassembling; packaging; axisymmetric geometry; conductive adhesives; die attach assembly; electronic interconnect structures; finite element analysis; modelling methods; square die; stress level; three-dimensional geometry; two-dimensional geometry; Assembly; Boundary conditions; Computational geometry; Conductive adhesives; Finite element methods; Manufacturing; Microassembly; Predictive models; Solid modeling; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346750

Filename

346750