Rigorous electromagnetic modeling of chip-to-package (first-level) interconnections

Author

Tsuei, Yuh-Sheng ; Cangellaris, Andreas C. ; Prince, John L.

Author_Institution

Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA

fYear

1993

fDate

1-4 Jun 1993

Firstpage

623

Lastpage

629

Abstract

A methodology is presented for the rigorous electromagnetic analysis of pulse transmission through first-level interconnects. The methodology combines a full-wave, vectorial, time-dependent Maxwell´s equations solver with SPICE circuit models for the nonlinear drivers, to facilitate the accurate modeling of the electromagnetic phenomena occurring at the chip-to-package interface. Comparisons of the results obtained using this method with others calculated using SPICE simulations are used to validate the method and demonstrate its application in the electromagnetic modeling of high-speed packaging structures

Keywords

Maxwell equations; SPICE; circuit analysis computing; finite difference time-domain analysis; integrated circuit technology; modelling; packaging; EM analysis; SPICE circuit models; chip-to-package interconnections; chip-to-package interface; electromagnetic modeling; electromagnetic phenomena; first-level interconnections; full-wave vectorial equations solver; high-speed packaging structures; nonlinear drivers; pulse transmission; time-dependent Maxwell equations solver; Bonding; Circuit simulation; Electromagnetic analysis; Electromagnetic fields; Electromagnetic modeling; Integrated circuit interconnections; Maxwell equations; Nonlinear equations; SPICE; Solid modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346784

Filename

346784