• DocumentCode
    2306849
  • Title

    TDDB characterisation of thin SiO/sub 2/ films with bimodal failure populations

  • Author

    Prendergast, James ; Suehle, John ; Chaparala, Prasad ; Murphy, Eammon ; Stephenson, Malcom

  • Author_Institution
    Analog Devices Inc., Limerick, Ireland
  • fYear
    1995
  • fDate
    4-6 April 1995
  • Firstpage
    124
  • Lastpage
    130
  • Abstract
    The paper deals with the extensive characterisation of a 20-nm oxide using multiple wafer fabrication lots. The data generated indicate that the intrinsic wearout properties of the oxide are best modelled by the E model with a field-dependent activation energy and a constant field acceleration factor. Of the 3 lots used in the characterisation one exhibited bimodal characteristics with a large extrinsic population. This allowed the investigation of the extrinsic distribution separately which exhibited a 1/E dependence and a field-dependent activation energy. The paper shows that using censored data for bimodal distributions results in the incorrect model (1/E) being used to predict intrinsic wearout. The paper also shows that in order to differentiate between the two models sample sizes must be run to 100% failure to ensure that true intrinsic wearout has been observed. The characterisation matrix used in the evaluation was very comprehensive and indicates E-fields of 7 MV/cm and below must be used to determine the correct field acceleration model.
  • Keywords
    MIS structures; dielectric thin films; electric breakdown; failure analysis; silicon compounds; E model; MOS oxide films; SiO/sub 2/; TDDB characterisation; bimodal failure populations; censored data; characterisation matrix; constant field acceleration factor; extrinsic distribution; field acceleration model; field-dependent activation energy; intrinsic wearout properties; multiple wafer fabrication lots; thin SiO/sub 2/ films; Capacitors; Electric breakdown; Failure analysis; Packaging; Particle measurements; Performance evaluation; Silicon; System testing; Temperature distribution; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1995. 33rd Annual Proceedings., IEEE International
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-2031-X
  • Type

    conf

  • DOI
    10.1109/RELPHY.1995.513665
  • Filename
    513665