Palladium-catalyzed sintering of molybdenum paste applied to multilayer substrate fabrication

Author

Kumar, Ananda H.

Author_Institution

Technol. Products Div., IBM Corp., Hopewell Junction, NY, USA

fYear

1993

fDate

1-4 Jun 1993

Firstpage

550

Lastpage

554

Abstract

This paper describes a novel method for densifying the surfaces of external, thick film molybdenum circuit features of multilayer ceramic substrates using palladium as a sintering catalyst. Such dense sintering of the surface effectively prevents the formation of undesirable pools of glass on the surfaces of the external features, making it possible to perform contact-probe electrical testing prior to plating and to nickel plate the molybdenum features without the customary cleaning steps needed to clear the pools of glass

Keywords

catalysis; densification; integrated circuit technology; molybdenum; palladium; sintering; substrates; thick film circuits; Mo; Ni; contact-probe electrical testing; external features; glass pools; molybdenum paste; multilayer ceramic substrate fabrication; nickel plating; palladium-catalyzed sintering; surface densification; thick film circuit; Ceramics; Circuit testing; Contacts; Glass; Nonhomogeneous media; Palladium; Performance evaluation; Substrates; Thick film circuits; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346791

Filename

346791