• DocumentCode
    2307079
  • Title

    Featured elastomer design for connector applications

  • Author

    Brodsky, W.L. ; Knight, A.D. ; Macek, T.

  • Author_Institution
    Technol. Products Div., IBM Corp., Endicott, NY, USA
  • fYear
    1993
  • fDate
    1-4 Jun 1993
  • Firstpage
    465
  • Lastpage
    467
  • Abstract
    This paper discusses a molded elastomeric structure that has been developed for use in connector applications. With the use of elastomeric materials, several challenges occur such as: dimensional stability for a grid of contacts as the elastomer member is compressed; contact force distribution across a grid of electrical contacts supported by a homogeneous molded elastomeric member constrained by boundary conditions; compressive stiffness of the elastomer and its ability to accommodate actuation tolerances within a contact force range; and structural stability of slender elastomeric features when used to increase the elastomeric structures compliancy. As connector I/O and densities increase, use of elastomeric materials with flexible circuits to replace metallic spring and conductor combinations is increasing. One advantage of this combination is the ability to arrange the contacts into dense arrays. In addition to the physical geometry, the component set offers several advantages to the electrical designer, dielectric constant, characteristic impedance, etc
  • Keywords
    elastic deformation; elastomers; electric connectors; mechanical stability; printed circuit accessories; stress relaxation; compressive stiffness; connector applications; contact force distribution; dimensional stability; electrical contact grid; featured elastomer design; flexible circuits; molded elastomeric structure; structural stability; Boundary conditions; Conducting materials; Connectors; Contacts; Dielectric materials; Flexible printed circuits; Inorganic materials; Springs; Stability; Structural engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1993. Proceedings., 43rd
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-0794-1
  • Type

    conf

  • DOI
    10.1109/ECTC.1993.346805
  • Filename
    346805