Title :
Miniature multi-contact ZIF connector design using leverage from internal flexible fine metal pins
Author :
Ichimura, Yoshiaki ; Endo, Hiroshi
Author_Institution :
Japan Aviation Electron. Ind. Ltd., Tokyo, Japan
Abstract :
A high density ZIF connector for LSI packages with a new structure of lead and wire-to-board connection has been developed. The outline of the prototype connector for the LSI package is as follows: 1.) contact spacing - 0.5 mm grid; 400 contacts (9.5×9.5 mm). 2.) Connectors size: 11 mm high; 18 mm×26 mm (mounting area). The principle of this mechanism, as well as two applications examples are herein introduced. In addition, the results of various test procedures performed on contacts and pins are included
Keywords :
electric connectors; large scale integration; packaging; printed circuit accessories; 0.5 mm; 11 mm; LSI packages; high density ZIF connector; internal flexible fine metal pins; miniature connector design; multicontact ZIF connector; test procedures; zero force insertion; Connectors; Contacts; Electronics packaging; Large scale integration; Performance evaluation; Pins; Prototypes; Shape; Sockets; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346807
