• DocumentCode
    230712
  • Title

    Micro-Hollow Cathode Discharge (MHCD) MEMS arrays for high-current cold cathodes

  • Author

    Ortega, J.A. ; Hunt, Charles E. ; Quan Hu

  • Author_Institution
    ECE Dept., Univ. of California, Davis, Davis, CA, USA
  • fYear
    2014
  • fDate
    6-10 July 2014
  • Firstpage
    198
  • Lastpage
    199
  • Abstract
    Micro Hollow Cathode Discharge (MHCD) arrays, fabricated in silicon with Al2O3 or titanium silicide- coated cathodes, have been investigated for use as high-current, coldcathode electron sources. When arranged as large arrays, micron-scale MHCD´s have the potential to be used as electronbeam sources with current densities up into the A-cm-2 range. Analysis, simulations and experimental data show that a quantum-mechanical tunneling current through the aluminum oxide cathode coating (when made thin enough) allows the DC operation of a MHCD at modest vacuum using Ar. The high secondary-electron emission and low sputter yield, of Al2O3 leads to increases in the plasma electron density and cathode operating lifetimes, respectively. Preliminary data show a significant increase in current density under identical operating conditions, using the alumina dielectric-coated cathodes as compared with bare-silicon baseline cathodes.
  • Keywords
    electron density; electron emission; glow discharges; micromechanical devices; oxide coated cathodes; sputtered coatings; Al2O3; MEMS arrays; MHCD arrays; Si; alumina dielectric-coated cathodes; aluminum oxide cathode coating; bare-silicon baseline cathodes; cold cathode electron; electronbeam sources; high-current cold cathodes; microhollow cathode discharge arrays; micron scale MHCD; plasma electron density; quantum-mechanical tunneling current; secondary-electron emission; sputter yield; titanium silicide- coated cathodes; Artificial intelligence; Cathodes; Silicon; Titanium; Al2O3; MEMS; MHCD; Titanium Silicide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Nanoelectronics Conference (IVNC), 2014 27th International
  • Conference_Location
    Engelberg
  • Print_ISBN
    978-1-4799-5306-6
  • Type

    conf

  • DOI
    10.1109/IVNC.2014.6894807
  • Filename
    6894807