Double sided flexible carrier with discretes and thermally enhanced FCA/COF

Author

Milkovich, Cynthia S. ; Gaynes, Michael A. ; Perkins, Jeffrey S.

Author_Institution

IBM Corp., Endicott, NY, USA

fYear

1993

fDate

1-4 Jun 1993

Firstpage

16

Lastpage

21

Abstract

This paper describes an electronic assembly that uses SMT components, wire bonded chips as well as area array chips attached to a flexible carrier. The wire bond chip is reworkable until encapsulation. Heat spreaders are attached to flip chips and wire bond chips with thermally conductive adhesives. Volume constraints imposed by a system design can he satisfied by populating both sides of a flexible carrier with components. Potential cost savings and reliability gains are possible with this electronic assembly design. A single flexible carrier with chips can replace multiple printed circuit cards and two levels of interconnection

Keywords

circuit reliability; encapsulation; flip-chip devices; microassembling; packaging; soldering; surface mount technology; SMT components; area array chips; chip-on-flex; discrete components; double sided flexible carrier; electronic assembly; flip chip attach; heat spreaders; thermally conductive adhesives; thermally enhanced FCA/COF; wire bonded chips; Assembly; Bonding; Conductive adhesives; Costs; Encapsulation; Flexible printed circuits; Flip chip; Surface-mount technology; Thermal conductivity; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346857

Filename

346857