Title :
Double sided flexible carrier with discretes and thermally enhanced FCA/COF
Author :
Milkovich, Cynthia S. ; Gaynes, Michael A. ; Perkins, Jeffrey S.
Author_Institution :
IBM Corp., Endicott, NY, USA
Abstract :
This paper describes an electronic assembly that uses SMT components, wire bonded chips as well as area array chips attached to a flexible carrier. The wire bond chip is reworkable until encapsulation. Heat spreaders are attached to flip chips and wire bond chips with thermally conductive adhesives. Volume constraints imposed by a system design can he satisfied by populating both sides of a flexible carrier with components. Potential cost savings and reliability gains are possible with this electronic assembly design. A single flexible carrier with chips can replace multiple printed circuit cards and two levels of interconnection
Keywords :
circuit reliability; encapsulation; flip-chip devices; microassembling; packaging; soldering; surface mount technology; SMT components; area array chips; chip-on-flex; discrete components; double sided flexible carrier; electronic assembly; flip chip attach; heat spreaders; thermally conductive adhesives; thermally enhanced FCA/COF; wire bonded chips; Assembly; Bonding; Conductive adhesives; Costs; Encapsulation; Flexible printed circuits; Flip chip; Surface-mount technology; Thermal conductivity; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346857
