Title :
Package test interface fixture considering low cost solution, high electrical performance, and compatibility with fine pitch packages
Author :
Song, Ki-Jae ; Seo, Hunkyo ; Ko, Sang-hyun
Author_Institution :
Test & Package Center, Samsung Electron., Suwon, South Korea
Abstract :
This paper introduces the package test interface fixture with low cost test topology, high electrical performances, and compatibility with fine pitch packages. The proposed fixture demonstrates electrical performance using special jig and mobile DDR2.
Keywords :
electronics packaging; fine-pitch technology; random-access storage; DDR2; fine pitch package; low cost test topology; package test interface fixture;
Conference_Titel :
Test Conference (ITC), 2010 IEEE International
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-7206-2
DOI :
10.1109/TEST.2010.5699264
