• DocumentCode
    2309505
  • Title

    Package test interface fixture considering low cost solution, high electrical performance, and compatibility with fine pitch packages

  • Author

    Song, Ki-Jae ; Seo, Hunkyo ; Ko, Sang-hyun

  • Author_Institution
    Test & Package Center, Samsung Electron., Suwon, South Korea
  • fYear
    2010
  • fDate
    2-4 Nov. 2010
  • Firstpage
    1
  • Lastpage
    9
  • Abstract
    This paper introduces the package test interface fixture with low cost test topology, high electrical performances, and compatibility with fine pitch packages. The proposed fixture demonstrates electrical performance using special jig and mobile DDR2.
  • Keywords
    electronics packaging; fine-pitch technology; random-access storage; DDR2; fine pitch package; low cost test topology; package test interface fixture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference (ITC), 2010 IEEE International
  • Conference_Location
    Austin, TX
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-7206-2
  • Type

    conf

  • DOI
    10.1109/TEST.2010.5699264
  • Filename
    5699264
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2309505