• DocumentCode
    2309567
  • Title

    Design and implementation of on-chip embedded current probe using magnetic field coupling in chip to chip wireless power transfer system

  • Author

    Cho, Changhyun ; Cho, Jonghyun ; Kim, Myunghoi ; Kim, Joungho ; Pak, Jun So

  • Author_Institution
    Dept. of Electr. Eng., KAIST, Daejeon, South Korea
  • fYear
    2012
  • fDate
    10-11 May 2012
  • Firstpage
    249
  • Lastpage
    252
  • Abstract
    In this paper, we present an on-chip embedded current probe that uses magnetic field coupling to determine the current flowing on a target channel without breaking the circuit. A helically wound 3 dimensional on chip inductor is adopted as a current probe. We first investigate the characteristics of mutual induction for this current probing structure in various geometrical design parameters like coupling distance, area of magnetic flux linkage and ratio of turns. And then we describe how to process the magnetically induced voltage to reconstruct a current waveform. Finally we validate the performance of proposed on-chip current probe by the experimental results of test vehicle fabricated in PCB.
  • Keywords
    electromagnetic coupling; electromagnetic induction; magnetic flux; magnetic leakage; microwave power transmission; printed circuits; signal reconstruction; system-on-chip; waveform analysis; PCB; chip to chip wireless power transfer; current waveform reconstruction; helical wound 3D on-chip inductor; magnetic field coupling; magnetic flux linkage; mutual induction; on-chip embedded current probe; target channel; Coils; Couplings; Impedance; Probes; System-on-a-chip; Voltage measurement; Wireless communication; 3D IC; current probe; helical inductor; mutual induction; signal reconstruction; wireless power transfer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Workshop Series on Innovative Wireless Power Transmission: Technologies, Systems, and Applications (IMWS), 2012 IEEE MTT-S International
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4673-1777-1
  • Type

    conf

  • DOI
    10.1109/IMWS.2012.6215804
  • Filename
    6215804