• DocumentCode
    2310056
  • Title

    Water diffusion model for the enhancement of hot-carrier-induced degradation due to silicon nitride passivation in submicron MOSFET´s

  • Author

    Shimaya, Masakazu

  • Author_Institution
    LSI Labs., NTT Corp., Kanagawa, Japan
  • fYear
    1995
  • fDate
    4-6 April 1995
  • Firstpage
    292
  • Lastpage
    296
  • Abstract
    The enhancement of hot-carrier-induced degradation due to SiN passivation can show strong dependence on the hot-carrier hardness of MOSFETs without SiN passivation. Additional post-passivation annealing also shows the acceleration phenomenon of degradation enhancement due to SiN passivation. The hot-carrier hardness dependence and APPA effect on degradation enhancement were investigated using several samples that have different hot-carrier hardness. A newly proposed degradation enhancement model, based on water diffusion, explains well the experimental results. The solution of a one-dimensional diffusion equation that is applied to the structure of inter-metal layer and passivation in MOSFETs, supports this model rather than a common hydrogen diffusion model.
  • Keywords
    MOSFET; annealing; diffusion; hot carriers; passivation; semiconductor device models; semiconductor device reliability; APPA effect; SiN; acceleration phenomenon; degradation enhancement; degradation enhancement model; hot-carrier hardness; hot-carrier-induced degradation; inter-metal layer; one-dimensional diffusion equation; passivation; post-passivation annealing; submicron MOSFETs; water diffusion model; Acceleration; Annealing; Degradation; Equations; Hot carrier effects; Hot carriers; Hydrogen; MOSFETs; Passivation; Silicon compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1995. 33rd Annual Proceedings., IEEE International
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-2031-X
  • Type

    conf

  • DOI
    10.1109/RELPHY.1995.513694
  • Filename
    513694