DocumentCode
2310056
Title
Water diffusion model for the enhancement of hot-carrier-induced degradation due to silicon nitride passivation in submicron MOSFET´s
Author
Shimaya, Masakazu
Author_Institution
LSI Labs., NTT Corp., Kanagawa, Japan
fYear
1995
fDate
4-6 April 1995
Firstpage
292
Lastpage
296
Abstract
The enhancement of hot-carrier-induced degradation due to SiN passivation can show strong dependence on the hot-carrier hardness of MOSFETs without SiN passivation. Additional post-passivation annealing also shows the acceleration phenomenon of degradation enhancement due to SiN passivation. The hot-carrier hardness dependence and APPA effect on degradation enhancement were investigated using several samples that have different hot-carrier hardness. A newly proposed degradation enhancement model, based on water diffusion, explains well the experimental results. The solution of a one-dimensional diffusion equation that is applied to the structure of inter-metal layer and passivation in MOSFETs, supports this model rather than a common hydrogen diffusion model.
Keywords
MOSFET; annealing; diffusion; hot carriers; passivation; semiconductor device models; semiconductor device reliability; APPA effect; SiN; acceleration phenomenon; degradation enhancement; degradation enhancement model; hot-carrier hardness; hot-carrier-induced degradation; inter-metal layer; one-dimensional diffusion equation; passivation; post-passivation annealing; submicron MOSFETs; water diffusion model; Acceleration; Annealing; Degradation; Equations; Hot carrier effects; Hot carriers; Hydrogen; MOSFETs; Passivation; Silicon compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1995. 33rd Annual Proceedings., IEEE International
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-2031-X
Type
conf
DOI
10.1109/RELPHY.1995.513694
Filename
513694
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