• DocumentCode
    2310068
  • Title

    A miniature GPS planar chip antenna integrated with low noise amplifier1

  • Author

    Wang, Chao-Wei ; Chen, Yen-Ming ; Yang, Chang-Fa ; Lin, Shun-Tian ; Liao, Chang-Lun ; Hu, Chuan-Ling

  • Author_Institution
    Nat. Taiwan Univ. of Sci. & Technol., Taipei
  • fYear
    2007
  • fDate
    9-15 June 2007
  • Firstpage
    1241
  • Lastpage
    1244
  • Abstract
    A planar chip antenna integrated with a low noise amplifier (LNA) for GPS applications at 1.575 GHz is presented in this paper. Software packages, XFDTD and HFSS have been applied to design the chip antenna having dimensions of 10 mm (L) times 8 mm (W) times 0.8 mm (H). An insert molding approach is applied to manufacture the antenna, where meandered metal strips are enclosed with liquid crystal polyester (LCP) to form the chip antenna. Thus, this chip antenna comprises a radiating structure of multiple meandered conducting strips packed with an LCP dielectric composite material to achieve size, performance characteristics and cost effectiveness superior to conventional GPS ceramic patch antennas. The compact surface-mount chip antenna is fully compatible with hand- and reflow- attachment processes. Also, no additional impedance-matching circuit is required so that the occupied length of the antenna built in a GPS receiver operating at 1.575 GHz is just 10 mm.
  • Keywords
    Global Positioning System; UHF amplifiers; UHF antennas; low noise amplifiers; planar antennas; HFSS; XFDTD; frequency 1.575 GHz; hand attachment; liquid crystal polyester; low noise amplifier; meandered metal strips; miniature GPS planar chip antenna; reflow attachment; size 0.8 mm; size 10 mm; size 8 mm; surface-mount chip antenna; Application software; Ceramics; Composite materials; Costs; Dielectrics; Global Positioning System; Liquid crystals; Low-noise amplifiers; Manufacturing; Software packages;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2007 IEEE
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    978-1-4244-0877-1
  • Electronic_ISBN
    978-1-4244-0878-8
  • Type

    conf

  • DOI
    10.1109/APS.2007.4395726
  • Filename
    4395726