Abstract :
The following topics are dealt with: low-cost ATE in the GHz era; microprocessor test including at-speed learning; DFT advances; ATPG techniques; post-silicon validation; 3D test; memory online test and fault tolerance; RF test techniques; scan compression; detecting and understanding defects; parallel TG and fault simulation and diagnostic TG; DFM and yield-learning via design and data analysis; DFT for HF ICs; advanced topics in board test; ATE SW advances; new issues and enhancements to IEEE 1149.1; RTL, high-level test and timing emulation; characterization methods for variability, defects, and bio-fluidics; analog testing; soft-error tolerance and multi-core testing; test, margin, and yield; and advanced industrial test practices.
Keywords :
analogue integrated circuits; automatic test equipment; automatic test pattern generation; biological fluid dynamics; design for manufacture; design for testability; fault simulation; fault tolerance; integrated circuit testing; integrated memory circuits; microprocessor chips; parallel processing; radiofrequency integrated circuits; three-dimensional integrated circuits; tolerance analysis; 3D test; ATE SW advances; ATPG techniques; DFT advances; GHz ATE; HF IC; HF integrated circuits; IEEE 1149.1 enhancements; RF test techniques; RTL; advanced industrial test practices; analog testing; at-speed learning; automated test equipment; biofluidics; board test; data analysis; defect characterization; defect detection; design for manufacturing; diagnostic TG; fault simulation; fault tolerance; high-level test; low-cost ATE; memory online test; microprocessor test; multicore testing; parallel TG; parallel test generation; post-silicon validation; register transfer level; scan compression; soft-error tolerance; timing emulation; variability characterization; yield-learning;
