DocumentCode
2310557
Title
Design rules for a reliable surface micromachined IC sensor
Author
Bart, S. ; Chang, J. ; Core, T. ; Foster, L. ; Olney, A. ; Sherman, S. ; Tsang, W.
Author_Institution
Transp. & Ind. Products Div., Analog Devices Inc., Wilmington, MA, USA
fYear
1995
fDate
4-6 April 1995
Firstpage
311
Lastpage
317
Abstract
To build reliability into surface-micromachined IC sensors intended for safety applications, potential failure mechanisms were identified during the design phase. Conservative design rules were established to minimize or eliminate sensor failure. Standard IC mechanical and thermal stress tests validated both the sensor design and the design methodology.
Keywords
failure analysis; integrated circuit design; integrated circuit reliability; micromachining; microsensors; thermal stresses; IC mechanical tests; design methodology; design phase; design rules; potential failure mechanisms; reliability; safety applications; sensor failure; surface micromachined IC sensor; thermal stress tests; Automotive engineering; Circuit testing; Etching; Fabrication; Fingers; Mechanical sensors; Micromachining; Silicon; Substrates; Tensile stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1995. 33rd Annual Proceedings., IEEE International
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-2031-X
Type
conf
DOI
10.1109/RELPHY.1995.513697
Filename
513697
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