Title :
Design rules for a reliable surface micromachined IC sensor
Author :
Bart, S. ; Chang, J. ; Core, T. ; Foster, L. ; Olney, A. ; Sherman, S. ; Tsang, W.
Author_Institution :
Transp. & Ind. Products Div., Analog Devices Inc., Wilmington, MA, USA
Abstract :
To build reliability into surface-micromachined IC sensors intended for safety applications, potential failure mechanisms were identified during the design phase. Conservative design rules were established to minimize or eliminate sensor failure. Standard IC mechanical and thermal stress tests validated both the sensor design and the design methodology.
Keywords :
failure analysis; integrated circuit design; integrated circuit reliability; micromachining; microsensors; thermal stresses; IC mechanical tests; design methodology; design phase; design rules; potential failure mechanisms; reliability; safety applications; sensor failure; surface micromachined IC sensor; thermal stress tests; Automotive engineering; Circuit testing; Etching; Fabrication; Fingers; Mechanical sensors; Micromachining; Silicon; Substrates; Tensile stress;
Conference_Titel :
Reliability Physics Symposium, 1995. 33rd Annual Proceedings., IEEE International
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2031-X
DOI :
10.1109/RELPHY.1995.513697
