Reflow behavior of Mo nanoparticle added Sn-3.8Ag-0.7 Cu solder

Summary form only given. This work investigates the reflow behavior of lead-free Sn-3.8Ag-0.7Cu solder on Cu substrate in the presence of Mo nanoparticles up to 0.1 wt%. Solders were reflowed in a reflow oven up to six times. The melting behavior of the composite solder was investigated by differential scanning calorimeter. The spreading rate and wetting angle were evaluated to measure the solderability of the composite solder on Cu substrate. It is found that during multiple reflow the interfacial IMC thickness and scallop diameter decreased with the addition of Mo nanoparticles. The presence of Mo nanoparticles was found to hinder the formation of rod shaped Cu₆Sn₅ IMC during multiple reflow cycles. Investigation on the top surface of interfacial IMC shows that Mo nanoparticles does not dissolve into the solder and imparts their effects on interfacial IMC as particles.