Emerging embedded devices into substrate for more than moore era

3D integration is critical technology to adopt shorten time-to-market, increasing function per area and reducing cost for not only mobile products but also medical and industrial equipment. And it is expected bridge technology between electronics products and semiconductors. Under this circumstance, two different approaches such as stacked semiconductor with silicon interposer and embedded devices into a printed wiring board, have been developing by famous institutes and industrial companies in Europe, Japan, Korea, Taiwan and US. One of low cost solution of 3D integration is utilize printed circuit board technology with embedded active and passive devices into inner layer. The advantages of embedded devices into substrate are still not well known among OEMs (Original Equipment Manufacturers) and semiconductor packaging designers, and it makes one of barriers to utilize and propagate this technology. However, several reports are already demonstrated the embedded devices interconnection reliability is more than two times higher than conventional surface mount technology. In addition, the embedded devices into substrate are provides better electrical performance, reduced warpage of packaging substrate and reduced cost. Also the embedded devices into substrate are contributes smaller form factor, righter weight and better performance of final products such as smart phones, digital still cameras and mobile PCs. This paper shows drivers of embedded devices into substrates, potential applications, market expectations and current status of embedded devices into PCBs in Japanese manufacturers. In addition, technology roadmap of embedded devices into substrate and difficult challenges are addressed in this paper.