DocumentCode :
2311210
Title :
Reliability assessment of stretchable interconnects
Author :
Hsu, Yung-Yu ; Dimcic, Biljana ; Gonzalez, Mario ; Bossuyt, Frederick ; Vanfleteren, Jan ; De Wolf, Ingrid
Author_Institution :
IMEC, Leuven, Belgium
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
4
Abstract :
In this paper, we comprehensively investigate the fatigue life and the failure modes of horseshoe-patterned stretchable interconnects, through both experimental and numerical analysis. The experimental results demonstrate that the fatigue life of a horseshoe-patterned stretchable interconnect embedded into a silicone matrix is able to resist up to 3000 cycles for a uniaxial elongation of 10%. By increasing the magnitude of the uniaxial elongation up to 30%, the lifetime drops rapidly to 85 cycles. A power law curve fitting relating the elongation versus the number of stretching cycles (E-N curve) is proposed based on the above mentioned experimental results. Moreover, combining the numerical modeling with the experimental results, a modified Coffin-Manson equation for fatigue life prediction is proposed for further evaluation of reliability performance. Micrographs and the correlated numerical simulations of the non-encapsulated stretchable intereconnects provide the experimental evidences and numerical explanations of the three-step failure processes.
Keywords :
elongation; integrated circuit interconnections; integrated circuit reliability; numerical analysis; failure modes; fatigue life; fatigue life prediction; horseshoe-patterned stretchable interconnects; modified Coffin-Manson equation; numerical analysis; power law curve fitting; reliability; silicone matrix; uniaxial elongation; Copper; Encapsulation; Fatigue; Plastics; Strain; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699490
Filename :
5699490
Link To Document :
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