• DocumentCode
    2311210
  • Title

    Reliability assessment of stretchable interconnects

  • Author

    Hsu, Yung-Yu ; Dimcic, Biljana ; Gonzalez, Mario ; Bossuyt, Frederick ; Vanfleteren, Jan ; De Wolf, Ingrid

  • Author_Institution
    IMEC, Leuven, Belgium
  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, we comprehensively investigate the fatigue life and the failure modes of horseshoe-patterned stretchable interconnects, through both experimental and numerical analysis. The experimental results demonstrate that the fatigue life of a horseshoe-patterned stretchable interconnect embedded into a silicone matrix is able to resist up to 3000 cycles for a uniaxial elongation of 10%. By increasing the magnitude of the uniaxial elongation up to 30%, the lifetime drops rapidly to 85 cycles. A power law curve fitting relating the elongation versus the number of stretching cycles (E-N curve) is proposed based on the above mentioned experimental results. Moreover, combining the numerical modeling with the experimental results, a modified Coffin-Manson equation for fatigue life prediction is proposed for further evaluation of reliability performance. Micrographs and the correlated numerical simulations of the non-encapsulated stretchable intereconnects provide the experimental evidences and numerical explanations of the three-step failure processes.
  • Keywords
    elongation; integrated circuit interconnections; integrated circuit reliability; numerical analysis; failure modes; fatigue life; fatigue life prediction; horseshoe-patterned stretchable interconnects; modified Coffin-Manson equation; numerical analysis; power law curve fitting; reliability; silicone matrix; uniaxial elongation; Copper; Encapsulation; Fatigue; Plastics; Strain; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699490
  • Filename
    5699490