Title :
Ultra fine pitch flip chip interconnection for 3D integration
Author_Institution :
IBM Res. Tokyo, Tokyo, Japan
Keywords :
fine-pitch technology; flip-chip devices; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; 3D integration; IMC bonding; chip connection technology; fine pitch flip chip interconnection; pre-applied interchip fill; Arrays; Cellular phones; Flip chip; Laminates; Mobile communication; Three dimensional displays;
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2010.5699497
