The role of glaze in TPH analysis by CFD

This analysis is to understand the role of glaze in TPH by CFD tool " FLOTHERM". Through the transient thermal analysis, we see the Glaze is necessary for efficient performance of thermal printheads because it retards the escape of heat through the ceramic substrate, leaving more heat to flow into the thermal media. Through a simplified transient model, we can understand the key parameters to affect the TPH temperature profile and know a proper pattern glaze can improve the efficient and print quality by controlling peak temperature, temperature rise rate and temperature stay duration. In example, result shows accumulation heat increase with glaze layer remove and efficient reduce with heat flow into substrate and Al sink. 4.5 times power is needed to reach the same peak temperature. Sink temperature increase with power on/off cycle increase. That\´s mean the cooling capability requirement is to increase to keep accumulation heat effect. It is bad cycling, increase power/cooling requirement. By study now we know for different design requirement, we can choose a proper TPH for the product with printer device to make a best product. Besides, we also understand we can combine/mount a high conductivity & high heat capacity on a high dynamic load component/chip to eliminate thermal shock/oscillation on the component/chip or over heating on it. In order to make sure "FLOTHERM" have the ability to solve transient problem. A heater with sink has been tested to validate the transient type thermal model. Result shows FLOTHERM have the ability to solve transient problem.