• DocumentCode
    2311692
  • Title

    Performance of the LED array panel in a confined enclosure

  • Author

    Shyu, Jin-Cherng ; Hsu, Keng-Wei ; Yang, Kai-Shing ; Wang, Chi-Chuan

  • Author_Institution
    Dept. of Mech. Eng., Nat. Kaohsiung Univ. of Appl. Sci., Kaohsiung, Taiwan
  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This study performs an experimental study concerning performance of an LED array under natural convection. A total of 270 1-W LEDs having an efficiency of 75% are used to simulate a large LED panel. The size of the cooling heat sink is 348 mm × 558 mm having vertical plate fin configuration with a fin spacing of 9.33 mm. The effect of shrouding, including shrouding above the heat sink and the blockages being placed at the entrance and exit are investigated. For the shrouding effect above heat sink, the heat transfer coefficient is first slightly increased with the rise of shroud distance and peaks at a shroud distance of 20 mm, followed by a marginal decrease of heat transfer coefficient with the shroud distance. On the other hand, a continuous but a very small increase of the heat transfer coefficients with the inlet or outlet blockage distance is seen, yet no plateau is seen as opposed to the effect of shroud distance above heat sink. For the same blockage distance, normally the heat transfer coefficient for those being blocked at the exit is slightly higher than that of inlet blockage. The maximum temperature within the heat sink does not take place at the central position; rather it peaks at the quarter position of the heat sink due to edge effect and likely higher air flow at the center position. The average heat transfer coefficient reaches 6 W/m K as the upper shield is removed.
  • Keywords
    heat sinks; heat transfer; light emitting diodes; natural convection; LED array panel; confined enclosure; heat sink; heat transfer coefficient; natural convection; Arrays; Heat sinks; Heat transfer; Light emitting diodes; Temperature measurement; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699520
  • Filename
    5699520