Integrated RF circuits design and packaging in high contrast ceramic-polymer composites

The need for pliable, multifunctional RF circuits has resulted in the search for low-cost, convenient and flexible techniques, such as soft lithography, where a patterned metal design is printed on a desired polymer substrate. Hence, we present a low-cost and effective method for the formation of micro-patterns on a pliable, low-dielectric constant polymer-ceramic composite substrate for manufacturing of a bandpass filter with microtransfer molding technique which will be further extended to the fabrication of a stacked patch antenna design. Through this novel approach of blending microfabrication technology in microwave antenna design and fabrication, various metal patterns can be printed on described composite materials with desired dielectric in easy fabrication steps.