The control way of solder blister as plating machine breakdown

Tin plating of lead frame packages has been driven into the market to meet Green requirements. To avoid tin whiskers issue, Sn-Cu and Sn-Bi are the other option in stead of pure Tin plating. Copper oxidation will give rise solder blisters if machine breakdown during Sn-Cu plating process for lead frame packages. The poor contacts resulted in contact area due to copper oxidization which in turn caused the solder blisters. During SMT process such as components onto Printed Circuit Boards, solder blister caused solder bridging was found. This study shows that solder blisters will occur when the metal ions deposit in an irregular due to copper ion oxidization if plating machine breakdown. The gap between plating layers is growing during the reflow process, and is causing blisters. The paper will not focus on the study of performance of the type of organic additive, but is to study how long plating machine breakdown will cause solder blister because it is a very important control item for Sn-Cu plating process.