DocumentCode :
2311815
Title :
Low power micro spray cooling system
Author :
Lu, Chun-Fu ; Yang, Jinn-Cherng ; Chen, Chun-Jung ; Chien-Chung Fu
Author_Institution :
Electron. & Optoelectron. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
4
Abstract :
A piezoelectric micro-dispenser cooling system was used to solve the overheating problem that inside vehicles caused by solar radiation in summer. High temperature could lead failure or damaging of electronics and mechanical appurtenances of vehicles and causes a hot driver seat. Thus, it is an important research project to use a minimal power to cool down the temperature of vehicles. Since the temperature increases inside vehicles mainly from solar energy, we design a micro-cooling system could be operated by solar cell. If the exposure dose from sunlight is high, the formation of micro-spray droplet volume will also be high and enough to convert heat from solar energy by liquid evaporation. It could also be operated without any extra energy input. The measured data shows that temperature on the driver seat maintained at 46°C by the dispenser cooling system, instead of temperature rising up to 60°C at solar energy exposure doses as high as 1000 W/m2 and the relative humidity inside vehicle did not increase. In addition, the cooling system required less than 2.0 watts of power at flow rate of 4.0 mL/min for the generation of micro-droplets.
Keywords :
cooling; evaporation; humidity; piezoelectric devices; solar power; solar radiation; vehicles; dispenser cooling system; heat energy; hot driver seat; liquid evaporation; low power microspray cooling system; mechanical appurtenances; overheating problem; piezoelectric microdispenser cooling system; relative humidity; solar energy; solar radiation; temperature 46 C to 60 C; vehicles; Apertures; Cooling; Driver circuits; Films; Solar energy; Sun; Vehicles; PZT; cooling; dispenser; nozzle; solar; vehicle;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699528
Filename :
5699528
Link To Document :
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