• DocumentCode
    2312085
  • Title

    Direct plated copper metallized substrate for high brightness LED applications

  • Author

    Chiu, Mao-Ching

  • Author_Institution
    Tong Hsing Electron. Ind., Ltd., Taipei, Taiwan
  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    32
  • Keywords
    ceramics; conductors (electric); copper; light emitting diodes; microwave devices; power semiconductor devices; semiconductor device metallisation; thermal management (packaging); Cu; RF device; ceramic substrate; cooper conductor; dense memory stacks; direct plated copper; high brightness LED; high current application; metallized substrate; microwave device; power semiconductors; thermal demand applications; very high power application;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699544
  • Filename
    5699544
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2312085