DocumentCode :
2312114
Title :
Direct plated copper substrate for RF and microwave packaging applications
Author :
Wei, V.
Author_Institution :
Tong Hsing Electron. Ind., Ltd., Taipei, Taiwan
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
18
Keywords :
copper; electronics packaging; microwave devices; substrates; DPC substrate; DPC technology; RF packaging; direct plated copper substrate; high-frequency electrical characterization; high-frequency performance; microwave packaging; modified aircavity package; packaging solution; Copper; Electronic mail; Electronics industry; Packaging; Radio frequency; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699546
Filename :
5699546
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2312114
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