DocumentCode
2312114
Title
Direct plated copper substrate for RF and microwave packaging applications
Author
Wei, V.
Author_Institution
Tong Hsing Electron. Ind., Ltd., Taipei, Taiwan
fYear
2010
fDate
20-22 Oct. 2010
Firstpage
1
Lastpage
18
Keywords
copper; electronics packaging; microwave devices; substrates; DPC substrate; DPC technology; RF packaging; direct plated copper substrate; high-frequency electrical characterization; high-frequency performance; microwave packaging; modified aircavity package; packaging solution; Copper; Electronic mail; Electronics industry; Packaging; Radio frequency; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4244-9783-6
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2010.5699546
Filename
5699546
Link To Document