DocumentCode
2312669
Title
Reliability and failure analysis of capacitive substrate
Author
Chen, Yun-Tien ; Liu, Shur-Fen ; Chen, Meng-Huei ; Hung, Chin-Hsien
Author_Institution
Mater. & Chem. Res. Labs., Ind. Technol. Res. Inst., Taiwan
fYear
2010
fDate
20-22 Oct. 2010
Firstpage
1
Lastpage
4
Abstract
In this study, the high dielectric constant of the polymer/ceramic composites is used to fabricate capacitive substrates. The reliability and failure analysis of the capacitive substrate under temperature and voltage stress have been studied. The mean time to failure (MTTF) of the capacitive substrate shows a voltage exponent value dependence on applied voltage with a constant of ≃3.3 as the measurement temperature at 175 °C. The lifetime also indicates a temperature dependence of the MTTF with an activation energy of 1.2 eV in the temperature range of 125°C to 175°C under dc bias of 300 VDC. The failed samples exhibited a rapid increase leakage current indicating avalanche breakdown. Moreover, it is also shown that the failed samples have a decrease in the insulation resistance and capacitance value and an increase in dissipation factor, equivalent series resistance, reactance and impedance value.
Keywords
avalanche breakdown; failure analysis; reliability; substrates; avalanche breakdown; capacitance value; capacitive substrate; dissipation factor; equivalent series resistance; failure analysis; high dielectric constant; impedance value; insulation resistance; mean time to failure; polymer/ceramic composites; reliability; voltage stress; Capacitors; Ceramics; Leakage current; Resistance; Substrates; Temperature measurement; Voltage measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4244-9783-6
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2010.5699577
Filename
5699577
Link To Document