• DocumentCode
    2312669
  • Title

    Reliability and failure analysis of capacitive substrate

  • Author

    Chen, Yun-Tien ; Liu, Shur-Fen ; Chen, Meng-Huei ; Hung, Chin-Hsien

  • Author_Institution
    Mater. & Chem. Res. Labs., Ind. Technol. Res. Inst., Taiwan
  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this study, the high dielectric constant of the polymer/ceramic composites is used to fabricate capacitive substrates. The reliability and failure analysis of the capacitive substrate under temperature and voltage stress have been studied. The mean time to failure (MTTF) of the capacitive substrate shows a voltage exponent value dependence on applied voltage with a constant of ≃3.3 as the measurement temperature at 175 °C. The lifetime also indicates a temperature dependence of the MTTF with an activation energy of 1.2 eV in the temperature range of 125°C to 175°C under dc bias of 300 VDC. The failed samples exhibited a rapid increase leakage current indicating avalanche breakdown. Moreover, it is also shown that the failed samples have a decrease in the insulation resistance and capacitance value and an increase in dissipation factor, equivalent series resistance, reactance and impedance value.
  • Keywords
    avalanche breakdown; failure analysis; reliability; substrates; avalanche breakdown; capacitance value; capacitive substrate; dissipation factor; equivalent series resistance; failure analysis; high dielectric constant; impedance value; insulation resistance; mean time to failure; polymer/ceramic composites; reliability; voltage stress; Capacitors; Ceramics; Leakage current; Resistance; Substrates; Temperature measurement; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699577
  • Filename
    5699577