DocumentCode
2312845
Title
The EMI suppression of Ultra Thin MEMS microphone package
Author
Ko, Chih-Hsiang ; Lee, Hsin-Li ; Wang, Chin-Hung
Author_Institution
Ind. Technol. Res. Inst. (ITRI), Tainan, Taiwan
fYear
2010
fDate
20-22 Oct. 2010
Firstpage
1
Lastpage
3
Abstract
In this paper, we propose an Ultra Thin Flip-chip Package (UTFP) for MEMS microphone. We analyzed the electromagnetic interference (EMI) noise on the signal trace and E-field strength distribution in the package. To achieve the EMI suppression of MEMS microphone packages, we increased the quantity of the micro bumps, added the ground via in the substrate, and applied the metal coating around the acoustic port. The results show that the metal-coating acoustic port will increase EMI suppression by 14dB.
Keywords
electromagnetic interference; flip-chip devices; interference suppression; micromechanical devices; microphones; E-field strength distribution; EMI suppression; MEMS microphone; electromagnetic interference; metal coating acoustic port; microbumps; signal trace; ultra thin flip-chip package; Acoustics; Coatings; Electromagnetic interference; Micromechanical devices; Microphones; Noise; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4244-9783-6
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2010.5699588
Filename
5699588
Link To Document