Title :
The EMI suppression of Ultra Thin MEMS microphone package
Author :
Ko, Chih-Hsiang ; Lee, Hsin-Li ; Wang, Chin-Hung
Author_Institution :
Ind. Technol. Res. Inst. (ITRI), Tainan, Taiwan
Abstract :
In this paper, we propose an Ultra Thin Flip-chip Package (UTFP) for MEMS microphone. We analyzed the electromagnetic interference (EMI) noise on the signal trace and E-field strength distribution in the package. To achieve the EMI suppression of MEMS microphone packages, we increased the quantity of the micro bumps, added the ground via in the substrate, and applied the metal coating around the acoustic port. The results show that the metal-coating acoustic port will increase EMI suppression by 14dB.
Keywords :
electromagnetic interference; flip-chip devices; interference suppression; micromechanical devices; microphones; E-field strength distribution; EMI suppression; MEMS microphone; electromagnetic interference; metal coating acoustic port; microbumps; signal trace; ultra thin flip-chip package; Acoustics; Coatings; Electromagnetic interference; Micromechanical devices; Microphones; Noise; Substrates;
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2010.5699588
