• DocumentCode
    2312849
  • Title

    Galvanomagnetic and thermoelectric measurements on polycrystalline Bi88Sb12

  • Author

    Goldsmid, H.J. ; Volckmann, E.H.

  • Author_Institution
    Marlow Industries Inc., Dallas, TX, USA
  • fYear
    1997
  • fDate
    26-29 Aug 1997
  • Firstpage
    171
  • Lastpage
    175
  • Abstract
    Measurements of the electrical conductivity, Seebeck coefficient, Hall coefficient and magnetoresistance of Se-doped, Sn-doped and undoped Bi88Sb12 have been made over the temperature range 100 K to 300 K using transverse magnetic fields of up to 1 tesla. The material was polycrystalline and prepared by powder metallurgy. A simplified two-carrier theory is applied to the analysis of the experimental data and is shown to give a good qualitative description of the results. It is shown that the electrons and light holes have effective masses of the order of one-tenth of the free electron mass. On the other hand, the heavy holes have an effective mass in excess of the free electron mass
  • Keywords
    Hall effect; Seebeck effect; antimony alloys; bismuth alloys; effective mass; electrical conductivity; magnetoresistance; selenium alloys; tin alloys; 1 T; 100 to 300 K; Bi88Sb12SnSe; Hall coefficient; Se-doped Bi88Sb12; Seebeck coefficient; Sn-doped Bi88Sb12; effective masses; electrical conductivity; electron; free electron mass; galvanomagnetic measurements; heavy holes; light holes; magnetoresistance; polycrystalline Bi88Sb12; powder metallurgy; thermoelectric measurements; transverse magnetic fields; two-carrier theory; Bismuth; Charge carrier processes; Conducting materials; Conductivity measurement; Effective mass; Electric variables measurement; Magnetic field measurement; Magnetoresistance; Temperature distribution; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
  • Conference_Location
    Dresden
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-4057-4
  • Type

    conf

  • DOI
    10.1109/ICT.1997.667061
  • Filename
    667061