The improvement of delaminating at interface between molding compound and Gold substrate bond pad in BGA(ball grid array) package

The miniaturization and increasing complex integration of functional chips handheld devices such as cellular phones have led to the widespread adoption of chip scale packages (CSPs) and ball grid array (BGA) packages. Lighter weight, thinner thickness, smaller size, high I/O pins, low cost, high functions, high quality and green environmental material are trend of IC packages and continuously challenge manufacturer and material supplier to develop new technologies and new materials to meet the process requirements in packaging. Ball-grid arrays (BGA) packages which place output pins in the form of a solder ball matrix provides effective solutions for high capacity interconnections and efficient thermal management of the power ICs. The I/O connections of the BGA are generally fabricated on laminated substrates (BT-based) or polyimide-based films. Therefore, the entire area of substrate can be used to reroute the interconnection. BGA has the advantage of lower ground or power inductance thereby assigning ground or power nets via a shorter current path to PCB. The higher functional capabilities of the BGA package technology benefit high power and high speed ICs that require enhanced electrical and thermal performance. However, in BGA packaging the issue of delaminating between molding compound and wire bonding pad on the ENEPG (Electroless Ni Eletroless Pd immerse Gold) substrate after product pre-con test has been an issue to liability test defined by Joint Electron Device Engineering Council (JEDEC).