• DocumentCode
    2313100
  • Title

    The impact of fluorine on CMOS channel length and shallow junction formation

  • Author

    Der-Gao Lin ; Rost, T.A.

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    1993
  • fDate
    5-8 Dec. 1993
  • Firstpage
    843
  • Lastpage
    846
  • Abstract
    The effects of fluorine on shallow junction formation and CMOS channel length are evaluated in this report. In this study fluorine is implanted into the device LDD region. It was found that fluorine can significantly decrease the device channel length reduction and improve short channel behavior. It was also shown that fluorine can suppress dopant diffusion to form shallower junctions. These results may provide a new approach for relaxing thermal budget constraints and reducing short channel effects for scaling CMOS technologies to smaller dimensions.<>
  • Keywords
    diffusion in solids; fluorine; insulated gate field effect transistors; ion implantation; semiconductor junctions; CMOS channel length; CMOS technologies; LDD region; Si:F; dopant diffusion; fluorine implantation; scaling; shallow junction; short channel effects; thermal budget; Annealing; Boron; CMOS technology; Implants; Instruments; Ion implantation; Resistors; Silicon; Temperature; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1993. IEDM '93. Technical Digest., International
  • Conference_Location
    Washington, DC, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-1450-6
  • Type

    conf

  • DOI
    10.1109/IEDM.1993.347268
  • Filename
    347268