DocumentCode
2313100
Title
The impact of fluorine on CMOS channel length and shallow junction formation
Author
Der-Gao Lin ; Rost, T.A.
Author_Institution
Texas Instrum. Inc., Dallas, TX, USA
fYear
1993
fDate
5-8 Dec. 1993
Firstpage
843
Lastpage
846
Abstract
The effects of fluorine on shallow junction formation and CMOS channel length are evaluated in this report. In this study fluorine is implanted into the device LDD region. It was found that fluorine can significantly decrease the device channel length reduction and improve short channel behavior. It was also shown that fluorine can suppress dopant diffusion to form shallower junctions. These results may provide a new approach for relaxing thermal budget constraints and reducing short channel effects for scaling CMOS technologies to smaller dimensions.<>
Keywords
diffusion in solids; fluorine; insulated gate field effect transistors; ion implantation; semiconductor junctions; CMOS channel length; CMOS technologies; LDD region; Si:F; dopant diffusion; fluorine implantation; scaling; shallow junction; short channel effects; thermal budget; Annealing; Boron; CMOS technology; Implants; Instruments; Ion implantation; Resistors; Silicon; Temperature; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1993. IEDM '93. Technical Digest., International
Conference_Location
Washington, DC, USA
ISSN
0163-1918
Print_ISBN
0-7803-1450-6
Type
conf
DOI
10.1109/IEDM.1993.347268
Filename
347268
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