DocumentCode :
2313282
Title :
Thermal conductivity of thermoelectric thick films deposited by an electrodeposition process
Author :
Chien, Heng-Chieh ; Yang, Chii-Rong ; Liao, Li-Ling ; Yao, Da-Jeng ; Liu, Chun-Kai ; Dai, Ming-Ji ; Tain, Ra-Min
Author_Institution :
Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
4
Abstract :
Due to the lack of advanced technology and difficulties in sample preparing, direct measurement of thermal conductivity for thin-film thermoelectric material is rarely reported in literatures. In this work, there are four types of thermoelectric thin films measured for their intrinsic thermal conductivity by using a modified parallel-strip technique. These four types of thermoelectric thin films are of Bi-Te and Sb-Te compositions, resulting from electrodeposition process with different aqueous solutions. From the measurement results, three types of the films shown quite low intrinsic thermal conductivity less than 0.5 Wm-1 K-1; and one type of the films can not be measured due to sample preparing problem. According to the scanning electron microscope observations, the grain boundaries in the thermoelectric thin films are probably the cause that results in their low thermal conductivity and the fragile structure is the cause of difficulty for the sample preparation.
Keywords :
antimony compounds; bismuth compounds; electrodeposition; grain boundaries; scanning electron microscopy; semiconductor growth; semiconductor thin films; thermal conductivity; thermoelectricity; Bi2Te3; Sb2Te3; aqueous solutions; electrodeposition; grain boundaries; intrinsic thermal conductivity; scanning electron microscopy; thermoelectric thick films; thermoelectric thin films; Conductivity; Conductivity measurement; Electrical resistance measurement; Films; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699616
Filename :
5699616
Link To Document :
بازگشت