• DocumentCode
    2313282
  • Title

    Thermal conductivity of thermoelectric thick films deposited by an electrodeposition process

  • Author

    Chien, Heng-Chieh ; Yang, Chii-Rong ; Liao, Li-Ling ; Yao, Da-Jeng ; Liu, Chun-Kai ; Dai, Ming-Ji ; Tain, Ra-Min

  • Author_Institution
    Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Due to the lack of advanced technology and difficulties in sample preparing, direct measurement of thermal conductivity for thin-film thermoelectric material is rarely reported in literatures. In this work, there are four types of thermoelectric thin films measured for their intrinsic thermal conductivity by using a modified parallel-strip technique. These four types of thermoelectric thin films are of Bi-Te and Sb-Te compositions, resulting from electrodeposition process with different aqueous solutions. From the measurement results, three types of the films shown quite low intrinsic thermal conductivity less than 0.5 Wm-1 K-1; and one type of the films can not be measured due to sample preparing problem. According to the scanning electron microscope observations, the grain boundaries in the thermoelectric thin films are probably the cause that results in their low thermal conductivity and the fragile structure is the cause of difficulty for the sample preparation.
  • Keywords
    antimony compounds; bismuth compounds; electrodeposition; grain boundaries; scanning electron microscopy; semiconductor growth; semiconductor thin films; thermal conductivity; thermoelectricity; Bi2Te3; Sb2Te3; aqueous solutions; electrodeposition; grain boundaries; intrinsic thermal conductivity; scanning electron microscopy; thermoelectric thick films; thermoelectric thin films; Conductivity; Conductivity measurement; Electrical resistance measurement; Films; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699616
  • Filename
    5699616