• DocumentCode
    2313336
  • Title

    Fast and Efficient On-Chip Interconnection Delay Modeling for High Speed VLSI Systems

  • Author

    Aswatha, A.R. ; Basavaraju, T. ; Kumar, Sahoo Subhendu

  • Author_Institution
    Dayanand Sugar Coll. of Eng., Bangalore
  • fYear
    2008
  • fDate
    16-18 July 2008
  • Firstpage
    414
  • Lastpage
    417
  • Abstract
    Timing driven physical design, synthesis, and optimization tools need efficient closed-form delay models for estimating the delay associated with each net in an integrated circuit (IC) design. The total number of nets in a modern IC design has increased dramatically and exceeded millions. Therefore efficient modeling of interconnection is needed for high speed ICpsilas. This paper presents an closed-form expressions for RC and RLC interconnection trees in current mode signaling, which can be implemented in VLSI design tool. This analytical model expressions can be used for accurate calculation of delay after the design clock tree has been laid out and the design is fully routed. Evaluation of this analytical models is several orders of magnitude faster than simulation using SPICE.
  • Keywords
    SPICE; VLSI; circuit CAD; integrated circuit design; SPICE; VLSI design tool; VLSI system; closed-form delay model; design clock tree; integrated circuit design; on-chip interconnection delay modeling; very large scale integration; Analytical models; Closed-form solution; Delay estimation; Design optimization; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit synthesis; System-on-a-chip; Timing; Very large scale integration; Closed-form; Curent-mode; Modeling; Modified Nodal Analysis; Voltage-mode;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Emerging Trends in Engineering and Technology, 2008. ICETET '08. First International Conference on
  • Conference_Location
    Nagpur, Maharashtra
  • Print_ISBN
    978-0-7695-3267-7
  • Electronic_ISBN
    978-0-7695-3267-7
  • Type

    conf

  • DOI
    10.1109/ICETET.2008.87
  • Filename
    4579935