DocumentCode :
2313400
Title :
Negative resistance VLSI integrable devices
Author :
Skotnicki, T. ; Merckel, G.
Author_Institution :
CNS, CNET, Meylan, France
fYear :
1993
fDate :
5-8 Dec. 1993
Firstpage :
549
Lastpage :
552
Abstract :
A majority of the proposed up-to-date negative resistance (N.R.) elements, being based on resonant tunneling or other quantum effects, lack compatibility with the silicon VLSI process. This work thus proposes two novel, not only silicon, but even more desirable CMOS compatible, N.R. Structures. The first is obtained by slightly modifying the vertical bipolar transistor, commonly used in BiCMOS technologies. The second is a hybrid device consisting of a 3-D co-integration in an SOI film of two separately operational devices: a lateral bipolar transistor and an accumulation mode MOSFET. When activating simultaneously both transistors, this same structure also exhibits the N.R. characteristic.<>
Keywords :
BiCMOS integrated circuits; VLSI; active networks; integrated circuit technology; negative resistance; resonant tunnelling devices; semiconductor-insulator boundaries; silicon; 3D co-integration; CMOS compatible; SOI film; VLSI integrable devices; accumulation mode MOSFET; lateral bipolar transistor; negative resistance; resonant tunneling; vertical bipolar transistor; BiCMOS integrated circuits; Bipolar transistors; Electric resistance; Electrical resistance measurement; Energy consumption; Equivalent circuits; FETs; MOSFET circuits; Silicon; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1993. IEDM '93. Technical Digest., International
Conference_Location :
Washington, DC, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-1450-6
Type :
conf
DOI :
10.1109/IEDM.1993.347290
Filename :
347290
Link To Document :
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