• DocumentCode
    2313482
  • Title

    One micron precision optically aligned method for hot-embossing and nanoimprinting

  • Author

    Islam, R. ; Wieder, B. ; Lindner, P. ; Glinsner, T. ; Schaefer, C.

  • Author_Institution
    EV Group US Inc., Phoenix, AZ, USA
  • Volume
    2
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    931
  • Abstract
    This paper reports an optically aligned hot-embossing and imprinting method for biomedical, microfluidic, and microoptical sensors. Hot-embossing technology is a low cost, flexible fabrication method, which has demonstrated high aspect ratio polymer microstructures as well as nanoimprinting patterns. It uses polymer substrates to imprint a pattern created on a master stamp. This allows the stamp to produce many fully patterned substrates for a wide range of materials and short production cycle times, and is therefore suited for applications from rapid prototyping to high volume production. The typical misalignment for mechanical alignment in hot-embossing is in the range of ±50 μm. By contrast, optical alignment accuracy can be achieved within 1 μm. This paper shows the principal equipment designs for optical alignment and hot-embossing process on silicon and quartz substrates. Alignment was performed on modified EVG620.
  • Keywords
    micro-optics; microfluidics; microsensors; nanolithography; optical sensors; polymers; quartz; silicon; substrates; 1 micron; Si substrates; flexible fabrication method; high aspect ratio polymer microstructures; high volume production; hot-embossing lithography; low cost fabrication method; master stamp; modified EVG620; nanoimprinting; nanoimprinting patterns; polymer substrates; precision optically aligned method; quartz substrates; rapid prototyping; short production cycle times; Biomedical optical imaging; Biosensors; Costs; Microfluidics; Microstructure; Optical device fabrication; Optical materials; Optical polymers; Optical sensors; Production;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2002. Proceedings of IEEE
  • Print_ISBN
    0-7803-7454-1
  • Type

    conf

  • DOI
    10.1109/ICSENS.2002.1037234
  • Filename
    1037234