• DocumentCode
    2313532
  • Title

    Galvanostatic electrodeposition of SnCu2–4Ni1–2 as a lead-free solder

  • Author

    Chen, Jing-Yu ; Tsai, Ho-Cheng ; Wu, Pu-Wei

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    SnCu2-4Ni1-2 as a lead-free solder was prepared from both sulfate and chloride plating solutions by galvanostatic electrodeposition. Current-potential polarizations for both plating baths were obtained with their respective deposition rates measured. Characterizations including SEM, EDX, and XRD were carried out to obtain relevant materials properties.
  • Keywords
    X-ray chemical analysis; X-ray diffraction; copper alloys; electrodeposition; nickel alloys; scanning electron microscopy; solders; tin alloys; EDX; SEM; SnCu2-4Ni1-2; XRD; chloride plating solution; current-potential polarizations; galvanostatic electrodeposition; lead-free solder; sulfate plating solution; Copper; Electrodes; Films; Nickel; Tin; X-ray scattering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699635
  • Filename
    5699635
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2313532