Genetic optimization of multi-finger high-power amplifiers with miniature packaging structures

In this paper, we present a demonstration on the multi-finger InGaP/GaAs C-up HBT, which are capable of handling high power and can operate at low-power-supply voltages in the dual-band system of mobile PA applications. As a matter of fact, the proposed technique is very suitable for analyzing thermal packaging configurations of other HBTs as well. Particularly, by means of quantitative evaluations into the multi-finger InGaP/GaAs C-up HBT with different finger pitches, the improvement of the packaging design compared to C-up HBTs with similar geometries is clearly described.