• DocumentCode
    2313905
  • Title

    Manufacturing of complex bi-porous wick and applying to a loop heat pipe

  • Author

    Wu, Shen-Chun ; Chen, Sheng-Hao ; Lin, Fang-Zhou ; Yeh, Chien-Chih ; Wang, Shen-Kai ; Chen, Yau-Ming

  • Author_Institution
    Dept. of Aviation Mech. Eng., China Univ. Sci. & Technol., Taipei, Taiwan
  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The purpose of this paper is to develop an innovative complex capillary structure and to enhance the heat transfer capacity of a loop heat pipe´s evaporator. The wick had two layers porous structures. The outer layer was biporous structure, which formed micro-vapor channels. The inner layer was the monoporous wick, which provided high capillary force and increased the strength of the whole wick. Experimental results showed: at 85°Cas a tolerant temperature of evaporator wall, the maximum heat load of the complex wick reached 700W (36W/cm in heat flux). The heat transfer coefficient of evaporator was 116 kW/m, and the thermal resistance of the system was 0.08°C/W. Comparing with the performance of the monoporous wick, the biporous wick increased the maximum heat load in 67% (420W of monoporous wick) and lowered the total thermal resistance in about 100% (0.17°C/W of monoporous wick).
  • Keywords
    heat pipes; porous materials; thermal management (packaging); thermal resistance; capillary force; complex biporous wick; complex capillary structure; evaporator; heat transfer; loop heat pipe; microvapor channel; porous structure; thermal resistance; Fluids; Heat transfer; Powders; Resistance heating; Thermal resistance; Biporous wick; Complex wick structure; Loop heat pipes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699654
  • Filename
    5699654