DocumentCode
2314059
Title
Development of chemical sensor arrays for harsh environments and aerospace applications
Author
Hunter, G.W. ; Neudeck, P.G. ; Liu, C.C. ; Ward, B. ; Wu, Q.H. ; Dutta, P. ; Frank, M. ; Trimbol, J. ; Fulkerson, M. ; Patton, B. ; Makel, D. ; Thomas, V.
Author_Institution
NASA Glenn Res. Center, Cleveland, OH, USA
Volume
2
fYear
2002
fDate
2002
Firstpage
1126
Abstract
The aerospace industry requires the development of a range of chemical sensor technologies for such applications as fuel leak detection, fire detection, and emission monitoring. A range of chemical sensors are being developed based on: 1) Micromachining and microfabrication technology, 2) The use of nanocrystalline materials, and 3) The development of high temperature semiconductors, especially silicon carbide. However, due to issues of selectivity and cross-sensitivity, individual sensors are limited in the amount of information that they can provide in environments that contain multiple chemical species. Thus, sensor arrays are being developed to address detection needs in such multi-species environments. This paper discusses the sensor array development for harsh environment and aerospace applications such as leak and fire detection as well as emissions monitoring. Application of these arrays as well as their relative stage of development will be addressed.
Keywords
aerospace instrumentation; chemical sensors; high-temperature techniques; micromachining; microsensors; nanostructured materials; SiC; aerospace industry; chemical sensor array; cross-sensitivity; emission monitoring; fire detection; fuel leak detection; harsh environment; high temperature semiconductor; microfabrication technology; micromachining technology; multi-species environment; nanocrystalline material; selectivity; silicon carbide; Aerospace industry; Aerospace materials; Chemical sensors; Chemical technology; Fires; Fuels; Leak detection; Micromachining; Monitoring; Sensor arrays;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2002. Proceedings of IEEE
Print_ISBN
0-7803-7454-1
Type
conf
DOI
10.1109/ICSENS.2002.1037272
Filename
1037272
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