Comprehensive design considerations in die-package-board transceiver channel co-simulation

This paper addresses various challenges and considerations associated with high-speed serial link designs. As data rates increase, the importance of assessing overall channel performance grows. Silicon-package-board co-design that considers both frequency and time domain budgets is essential for robust implementation capable of accommodating anticipated channel degradation and achieving time-to-market goals. This paper focuses on a design methodology that can translate package/board transceiver channel loss, cross talk and power supply noise into system jitter degradation, which is a significant factor in the design of almost all communications links such as PCI Express, Ethernet, XAUI, Interlaken, etc. The paper will outline the analysis, modeling, simulation and characterization employed in the electrical design.