DocumentCode
2314151
Title
Thermoelectric properties of n-type (Pb1-xGex)Te fabricated by hot pressing method
Author
Choi, Jae-Shik ; Kim, Hee- Jeong ; Kim, Hang-Chong ; Oh, Tae-Sung ; Hyun, Dow-Bin ; Lee, Hee-Woong
Author_Institution
Dept. of Metall. & Mater. Sci., Honk Ik Univ., Seoul, South Korea
fYear
1997
fDate
26-29 Aug 1997
Firstpage
228
Lastpage
231
Abstract
To investigate the effects of solid solution alloying on thermoelectric properties of PbTe-based thermoelectric materials, 0.3 wt% Bi-doped (Pb1-xGex)Te alloy powders (0⩽x⩽0.15) were fabricated by “melting/grinding” process, and hot-pressed at 650°C and 750°C for 1 hour in vacuum. At temperatures ranging from 25°C to 450°C, the (Pb1-xGex)Te alloys exhibited more negative Seebeck coefficient, higher electrical resistivity and lower thermal conductivity with increasing GeTe content. The temperature, where the figure-of-merit of (Pb1-xGex)Te reached a maximum, was lowered with increasing GeTe content x. When hot-pressed at 650°C, 0.3 wt% Bi-doped PbTe and (Pb0.9Ge0.1)Te exhibited a maximum figure-of-merit of 1.07×10-3/K at 400°C and 1.25×10-3 /K at 300°C, respectively
Keywords
IV-VI semiconductors; Seebeck effect; bismuth; electrical resistivity; germanium compounds; hot pressing; lead compounds; powder technology; solid solutions; thermal conductivity; (PbGe)Te:Bi; 25 to 450 degC; 650 degC; 750 degC; GeTe content dependence; PbTe-based thermoelectric materials; electrical resistivity; hot pressing; maximum figure-of-merit; melting/grinding process; n-(PbGe)Te:Bi; negative Seebeck coefficient; powder fabrication; solid solution alloying; thermal conductivity; thermoelectric properties; Alloying; Electric resistance; Germanium alloys; Powders; Solids; Tellurium; Temperature distribution; Thermal conductivity; Thermal resistance; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
Conference_Location
Dresden
ISSN
1094-2734
Print_ISBN
0-7803-4057-4
Type
conf
DOI
10.1109/ICT.1997.667089
Filename
667089
Link To Document