Abstract :
The following topics are dealt with: ASE forum; SPIL forum; THEIL forum; NPC forum; advanced packaging technology; heterogeneous system integration; substrate; advanced sensor technology; advanced microsystem technology; quality assurance; international 3D IC forum; thermal management; CCL materials; solders; soldering; assembling; plating; interconnection; nanotechnology; and surface treatment.
Keywords :
electric sensing devices; electronics packaging; electroplating; integrated circuits; interconnections; micromechanical devices; nanotechnology; quality assurance; soldering; solders; substrates; surface treatment; thermal analysis; ASE forum; CCL materials; NPC forum; SPIL forum; THEIL forum; advanced microsystem technology; advanced packaging technology; advanced sensor technology; assembling; heterogeneous system integration; interconnection; international 3D IC forum; nanotechnology; plating; quality assurance; soldering; solders; substrate; surface treatment; thermal management;
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2010.5699677
