• DocumentCode
    2314397
  • Title

    Electrical properties of Si-XII and Si-III formed by nanoindentation

  • Author

    Wang, Y. ; Ruffell, S. ; Sears, K. ; Knights, A.P. ; Bradby, J.E. ; Williams, J.S.

  • Author_Institution
    Dept. of Electron. Mater. Eng., Australian Nat. Univ., Canberra, ACT, Australia
  • fYear
    2010
  • fDate
    12-15 Dec. 2010
  • Firstpage
    105
  • Lastpage
    106
  • Abstract
    Conventional silicon devices and integrated circuits are fabricated in the diamond cubic phase of silicon, so-called Si-I. Other phases of silicon can be formed under pressure applied by indentation and these phases are metastable at room-temperature and pressure. As we demonstrate, such phases behave entirely differently to normal diamond-cubic silicon (Si-I) having different electrical properties. Two such phases, Si-III (BC8) and Si-XII (R8), can be formed by indentation but little is known about their electrical properties. Theoretical studies predict Si-III to be a semimetal [1] and Si-XII to be a narrow band gap semiconductor [2]. We report the first electrical measurements on these phases, which we have formed by nanoindentation. We demonstrate that Si-XII is a semiconductor that can be electrically doped with boron and phosphorus at room temperature. We also demonstrate early devices formed by nanoindentation at room temperature.
  • Keywords
    boron; elemental semiconductors; nanoindentation; nanostructured materials; narrow band gap semiconductors; phosphorus; semiconductor doping; semimetals; silicon; Si-III (BC8) phase; Si-III electrical properties; Si-III semimetal; Si-XII (R8) phase; Si-XII electrical properties; Si-XII narrow band gap semiconductor; Si:B; Si:P; boron doping; diamond cubic phase; electrical doping; electrical measurements; integrated circuits; metastable phase; nanoindentation; normal diamond-cubic silicon; phosphorus doping; silicon devices; silicon phase; temperature 293 K to 298 K;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optoelectronic and Microelectronic Materials and Devices (COMMAD), 2010 Conference on
  • Conference_Location
    Canberra, ACT
  • ISSN
    1097-2137
  • Print_ISBN
    978-1-4244-7334-2
  • Electronic_ISBN
    1097-2137
  • Type

    conf

  • DOI
    10.1109/COMMAD.2010.5699682
  • Filename
    5699682