DocumentCode :
2314612
Title :
Passivation of highly boron doped silicon surfaces by sputtered AlOx and PECVD SiN, a comparison
Author :
Li, T.-T.A. ; Cuevas, A. ; Tan, J. ; Samundsett, C. ; Saynova, D. ; Geerligs, B.
Author_Institution :
Sch. of Eng., Australian Nat. Univ., Canberra, ACT, Australia
fYear :
2010
fDate :
12-15 Dec. 2010
Firstpage :
125
Lastpage :
126
Abstract :
We show that boron-diffused emitters can be passivated with AlOx deposited using RF sputtering of an Al target. The surface passivation achieved so far is inferior to that obtained using an optimised PECDV SiN process that includes a chemically grown SiO2 interfacial layer. Nevertheless, the levels of passivation obtained, expressed by emitter recombination current densities of JoE=228-349 fA/cm2 for sheet resistances of 88-210 Ω/□, are already consistent with solar cell with efficiencies in the 20% range.
Keywords :
boron; current density; electron-hole recombination; elemental semiconductors; heavily doped semiconductors; passivation; plasma CVD; silicon; silicon compounds; solar cells; sputter deposition; surface resistance; Al target; AlOx; RF sputtering; Si:B; SiN; SiO2; boron-diffused emitters; chemically grown silica interfacial layer; emitter recombination current densities; highly boron doped silicon surfaces; optimised PECDV SiN process; passivation levels; sheet resistances; solar cell; sputtered AlOx; surface passivation; Atomic layer deposition; Resistance; Silicon compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optoelectronic and Microelectronic Materials and Devices (COMMAD), 2010 Conference on
Conference_Location :
Canberra, ACT
ISSN :
1097-2137
Print_ISBN :
978-1-4244-7334-2
Electronic_ISBN :
1097-2137
Type :
conf
DOI :
10.1109/COMMAD.2010.5699694
Filename :
5699694
Link To Document :
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