Microwave power module (MPM) development and results

Author

Brees, A. ; Dohler, G. ; Duthie, J. ; Groshart, G. ; Pierce, G. ; Weyrich, R.

Author_Institution

Northrop ESD-RMS, Rolling Meadows, IL, USA

fYear

1993

fDate

5-8 Dec. 1993

Firstpage

145

Lastpage

148

Abstract

This paper describes the successful development and testing of a Microwave Power Module (MPM), a complete microwave amplifier package of unprecedented miniaturization: 0.32"/spl times/4"/spl times/6" (0.81/spl times/10.2/spl times/15.2 cm). The amplifier includes a helix Travelling Wave Tube (TWT) booster, a solid state amplifier (SSA) using Monolithic Microwave Integrated Circuit (MMIC) technology, power supply and power conditioner, and cooling. Other achievements include 100 W or more (CW) output power, >60 dB saturated gain, a noise figure of 7 dB or better in the SSA, and a booster efficiency of 30 percent or more from 6 to 18 GHz. Inherent features of such a device include low cost and high reliability. Applications include radar, electronic countermeasure (ECM), and communication transmitters. The modules can be combined for power combining and phased array applications.<>

Keywords

cooling; hybrid integrated circuits; integrated circuit testing; microwave amplifiers; microwave integrated circuits; multichip modules; power amplifiers; reliability; travelling-wave-tubes; waveguide components; 100 W; 30 percent; 5 to 18 GHz; 60 dB; 7 dB; MMIC technology; booster efficiency; communication transmitters; cooling; electronic countermeasure; helix travelling wave tube booster; microwave amplifier package; microwave power module; phased array applications; power combining; power conditioner; power supply; radar; reliability; solid state amplifier; Circuit testing; Electronic countermeasures; Integrated circuit packaging; MMICs; Microwave amplifiers; Microwave integrated circuits; Multichip modules; Phased arrays; Power amplifiers; Solid state circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting, 1993. IEDM '93. Technical Digest., International

Conference_Location

Washington, DC, USA

ISSN

0163-1918

Print_ISBN

0-7803-1450-6

Type

conf

DOI

10.1109/IEDM.1993.347379

Filename

347379