DocumentCode :
2314942
Title :
A SiC-CuC-Cu insulator for MHD generator channels
Author :
Okuo ; Ookouchi ; Aoki, Yuya
Author_Institution :
Electrotech. Lab., Tsukuba, Japan
fYear :
1989
fDate :
0-0 1989
Firstpage :
67
Lastpage :
68
Abstract :
Summary Form only given, as follows. The authors have tested improved SiC-CuC-Cu elements and shown their effectiveness as regards permissible heat flux, safe thermal shock conditions, electrical leakage, and breakdown between adjacent elements. To clarify the design specifications for the new elements, they examined the parameters generating degradation or destruction of the element. Under operating conditions exceeding permissible levels, considerable deterioration due to the reaction of potassium with SiC and severe ablation were observed. EPMA observation of post-test samples under permissible conditions showed diffusion and formation of a carbon-rich layer on the working surface. A direct relationship between the penetration of potassium and sulfur and the deterioration was not clear, even after 20 h. The crystal structure of SiC showed no change under permissible operating conditions. However, crystal granulation occurred, and peeling of the corner portions and a decrease of bond strength in the CuC compliant were observed when the permissible surface temperature was exceeded.<>
Keywords :
bonds (chemical); ceramics; copper compounds; crystal structure; diffusion in solids; electron probe analysis; insulation testing; magnetohydrodynamic convertors; silicon compounds; thermal insulating materials; C-rich layer; K; MHD generator channels; S; SiC-CuC-Cu insulator; ablation; bond strength; corner portion peeling; crystal granulation; crystal structure; degradation; destruction; deterioration; diffusion; electrical leakage; electron probe microanalysis; heat flux; safe thermal shock conditions; surface temperature; Ceramics; Chemical analysis; Copper compounds; Diffusion processes; Electron beam applications; Insulation testing; Magnetohydrodynamic conversion; Silicon compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science, 1989. IEEE Conference Record - Abstracts., 1989 IEEE International Conference on
Conference_Location :
Buffalo, NY, USA
Type :
conf
DOI :
10.1109/PLASMA.1989.166039
Filename :
166039
Link To Document :
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